JPH0211033B2 - - Google Patents

Info

Publication number
JPH0211033B2
JPH0211033B2 JP61073833A JP7383386A JPH0211033B2 JP H0211033 B2 JPH0211033 B2 JP H0211033B2 JP 61073833 A JP61073833 A JP 61073833A JP 7383386 A JP7383386 A JP 7383386A JP H0211033 B2 JPH0211033 B2 JP H0211033B2
Authority
JP
Japan
Prior art keywords
wiring
wire
hole
insulated
wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61073833A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62230092A (ja
Inventor
Masao Kanno
Naoki Fukutomi
Yorio Iwasaki
Fujio Kojima
Hidehiro Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP61073833A priority Critical patent/JPS62230092A/ja
Priority to US07/032,247 priority patent/US4791238A/en
Publication of JPS62230092A publication Critical patent/JPS62230092A/ja
Publication of JPH0211033B2 publication Critical patent/JPH0211033B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP61073833A 1986-03-31 1986-03-31 必要な配線パタ−ンに絶縁電線を使用した高密度配線板の製造法 Granted JPS62230092A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP61073833A JPS62230092A (ja) 1986-03-31 1986-03-31 必要な配線パタ−ンに絶縁電線を使用した高密度配線板の製造法
US07/032,247 US4791238A (en) 1986-03-31 1987-03-31 High-density wired circuit board using insulated wires

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61073833A JPS62230092A (ja) 1986-03-31 1986-03-31 必要な配線パタ−ンに絶縁電線を使用した高密度配線板の製造法

Publications (2)

Publication Number Publication Date
JPS62230092A JPS62230092A (ja) 1987-10-08
JPH0211033B2 true JPH0211033B2 (en]) 1990-03-12

Family

ID=13529534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61073833A Granted JPS62230092A (ja) 1986-03-31 1986-03-31 必要な配線パタ−ンに絶縁電線を使用した高密度配線板の製造法

Country Status (2)

Country Link
US (1) US4791238A (en])
JP (1) JPS62230092A (en])

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU610249B2 (en) * 1987-09-29 1991-05-16 Microelectronics And Computer Technology Corporation Customizable circuitry
US5165166A (en) * 1987-09-29 1992-11-24 Microelectronics And Computer Technology Corporation Method of making a customizable circuitry
US4888665A (en) * 1988-02-19 1989-12-19 Microelectronics And Computer Technology Corporation Customizable circuitry
US5081561A (en) * 1988-02-19 1992-01-14 Microelectronics And Computer Technology Corporation Customizable circuitry
US5201855A (en) * 1991-09-30 1993-04-13 Ikola Dennis D Grid system matrix for transient protection of electronic circuitry
JP3408590B2 (ja) * 1993-09-29 2003-05-19 富士通株式会社 多層プリント基板の配線構造
DE69934981T2 (de) * 1998-05-19 2007-11-15 Ibiden Co., Ltd., Ogaki Gedruckte leiterplatte und verfahren zur herstellung
US6262487B1 (en) 1998-06-23 2001-07-17 Kabushiki Kaisha Toshiba Semiconductor integrated circuit device, semiconductor integrated circuit wiring method, and cell arranging method
US6232564B1 (en) 1998-10-09 2001-05-15 International Business Machines Corporation Printed wiring board wireability enhancement
USD574339S1 (en) * 2005-06-24 2008-08-05 Nitto Denko Corporation Pattern formed on the ground layer of a multilayer printed circuit board

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3674914A (en) * 1968-02-09 1972-07-04 Photocircuits Corp Wire scribed circuit boards and method of manufacture
US3674602A (en) * 1969-10-09 1972-07-04 Photocircuits Corp Apparatus for making wire scribed circuit boards
US3969816A (en) * 1972-12-11 1976-07-20 Amp Incorporated Bonded wire interconnection system
FR2243578B1 (en]) * 1973-09-12 1976-11-19 Honeywell Bull Soc Ind
JPS5530822A (en) * 1978-08-25 1980-03-04 Fujitsu Ltd Printed board
JPS5543639A (en) * 1978-09-22 1980-03-27 Nec Corp Chinese character display system for cathoderay tube character display unit
US4554405A (en) * 1982-06-28 1985-11-19 International Business Machines Corporation High density encapsulated wire circuit board

Also Published As

Publication number Publication date
JPS62230092A (ja) 1987-10-08
US4791238A (en) 1988-12-13

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term